Bangalore Operations

Manufacturing Services

  • pointsNew Product Design Capability
  • pointsBoard layout and Design Capability
  • pointsDesign for manufacturing
  • pointsNew Product Introduction
  • pointsManufacturing Engineering
  • pointsResearch and Development
  • pointsHardware and software engineering
  • pointsCAD / CAM
  • pointsComplete products

CAPABILITIES

Board Assembly

  • pointsSurface mount
  • pointsAutomated and Manual Through hole Insertion
  • pointsBGA

Assembly Capabilities

  • pointsFlex lines
  • pointsBox build and Integration

Testing

  • pointsIn Circuit
  • pointsFunctional
  • pointsElevated Temperature
  • pointsMold making and Plastic Injection Molding
  • pointsWiring harness

FACILITIES –SURFACE MOUNT
TECHNOLOGY

  • pointsDEK / MPM – SOLDER PASTE PRINTING
  • pointsFUJI NXT3 – CHIP SHOOTER
  • pointsJUKI / YAMAHA – PICK & PLACE
  • pointsHELLER/VITRONICS – REFLOW OVEN
  • pointsAKI – AOI
  • pointsFIEN FOCUS – X RAY INSPECTION
  • pointsAPE INTRUDER – BGA REWORK STATION
  • pointsZ100 – SOLDER PASTE HEIGHT MEASUREMENT
  • pointsDE-HUMIDIFIER FOR MSD COMPONENTS
  • pointsLAMINAR FLOOR - FOR LENS ASSEMBLY
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FACILITIES – THROUGH HOLE
TECHNOLOGY

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  • pointsSEHO / EMS – WAVE SOLDERING
  • pointsUNIVERSAL – AUTO INSERTS & SEQUENCERS
  • pointsICT – JET
  • pointsOLAMEF – COMPONENT FORMING
  • pointsDEDICATED TEST BENCHES
  • pointsELEVATED BURN IN FACILITIES
  • pointsPROTO ASSEMBLY LINES
  • pointsFUNCTIONAL JIGS

Bangalore Production Line

FACILITIES –BOX BUILD
INTEGRATION LINE

  • pointsCOMPLETE PRODUCT ASSEMBLY LINE
  • pointsTHERMAL CHAMBER
  • pointsVIBRATION TEST SYSTEM
  • pointsBURNIN LINES FOR THE FINAL PRODUCT
  • pointsDEDICATED TEST EQUIPMENT FOR PRODUCT TESTING
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Turnkey Manufacturing
Solutions

Turnkey Manufacturing Solutions

  • pointsEnd to End solutionsfrom Design to Delivery
  • pointsQuality standards as per IPC-610E
  • pointsDedicated team for proto-type
  • pointsDocument Control & IP protection

Engineering Services

  • pointsDedicated member team
  • pointsDesign modification / PCB design capability
  • pointsAlternate solution for Obsolete parts
  • pointsSupport for EMI/EMC/UL/CE approvals

Value Proposition:

“Digital combines global resources with in house capabilitiesto create local success for our Customers”

Printed Circuit Board Layout
Design Capabilities

  • pointsHigh Speed Digital, Analog, Mixed & RF designs
  • pointsHigh layer count boards – 12+ layers
  • pointsHigh density PCBs – > 450 pins/Sq.In
  • pointsFine pitch BGA
  • pointsFlexible & Rigid flex PCB
  • pointsDesign for Manufacturability
  • pointsHighly skilled PCB / software engineers
  • pointsBest in Industry rates and competitive quoting

PCB Lay out

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Design Services…

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